For over 23 years, Royce Instruments, Inc. has been an innovative global leader for design and manufacturing of precision assembly tools and high accuracy, low force bond testing equipment.

Our products include equipment for laser diode manufacturing, wire bond and die bond testing, semiconductor die pick and place into trays, waffle pack, and GelPak

Products

Bond Testing	Royce Instruments bond testing systems handle a variety of testing applications. Capabilities include: - Wire bond loop pull testing - Wire bond ball shear testing - BGA ball shear and pull testing - Die bond shear testing - High speed ball shear testing
SYSTEM 650	● Motorized height controlled microscope that stays in focus as it moves ● 305 mm x 155 mm stage for 300 mm wafers, leadframes or substrates ●Ultra Fine Pitch (UFP) capable ● Image Capture Option which is Field Upgradable! ● World Language support ● Ribbon Bond testing for standard to high-power devices ● Die shear up to 200 kgf ● Robust test modules with Range switching, on board calibration memory, and tool protection
SYSTEM 226 Dedicated Wire Pull Tester	● Dedicated wire pull system, for up to 100g. ●Destructive and non-destructive testing (NDT) of wire bond loops. ● Small footprint. ● Meets MIL Standard 883 and is CE certified. ● Download data to in-house SPC using RS232
The controls of the 226 are simple and ergonomic. Using the extremely flexible Leica S6 microscope, the 226 easily adjusts to accommodate a broad spectrum of users. The familiar controls make training quick and easy, minimizing downtime. The standard computer mouse controls the hook height and rotation, along with triggering the test. A numeric keypad allows the operator to enter failure codes, and the test results are visible on the LCD panel built into the mainframe. Able to perform both destructive and non-destructive tests, the 226 collects force data against the wire every 10 microseconds. When performing destructive bond testing the maximum load is monitored and the test stops automatically when the load force falls from its maximum. Non-destructive testing is controlled so that the rate of load application exactly meets the user's programmed limit. Load variance also is programmable by the user prior to testing to provide stricter controls.
Die Handling
DE35-ST Semi-Automatic Die Handling System	●Available for 150 and 200mm diameter wafers. ●Picks die as small as 6mil square. ●700 to 1200 UPH throughput. Application dependent. ●Quick change multi-needle eject heads. ●Programmable output stage for waffle pack and Gelpaks. Alternative output formats also available. ●Pick and place program storage. ●Optional non-surface contact capability.
The DE35-ST Semi-automatic die pick and place system is an elegantly simple, low cost machine for picking die from sawn or scribed wafers mounted on adhesive film. Die can be placed into waffle packs, Gel-Paks?, film frame or directly on substrates. The DE35-ST eliminates the inefficiencies and down time usually found in small lot production. Simple to learn and use, the DE35i requires no hand tools for die size changeover and setup. Setup and option information is preserved in non-volatile memory so that, following a weekend shutdown for example, you can restart the machine without further setup. Waffle pack pockets for die placement are automatically selected. Manual selection using the keyboard arrow keys enables completion of partially filled waffle packs. If a grading output mode is selected, the machine places the die in the next pocket of the corresponding waffle pack and advises the operator when any of the waffle packs are full. Non-Surface Contact (NSC) Option Picks die without touching the top surface, ideal for handling die with touch sensitive coatings. Excellent for gripping force under 10g. Picks dies from 0.06 inch square to over 1.0 inch square. Die are gripped by Vespel conductive plastic finger tips. For small die sizes, micro-machined collets are available to suit individual applications.