Use the Right Tool to get the Right Result!

Scanning Acoustic Microscopy, commonly referred to as SAM or SAT (Scanning Acoustic Tomography) is unparalleled in its ability to spot delaminations, cracks and other anomalies non-destructively. Not only does acoustic microscopy detect the failures but it also can provide the specific location of the problem. Sonix SAMs high resolution images and advanced diagnostic tools are used to:

• Diagnose device failures and discover failure "root causes"
• Monitor production sampling
• Qualify new package or production designs
• Research new materials or processes

The Sonix Advantage

The purchase of a Scanning Acoustic Microscope (SAM) is a major decision. A primary consideration in the purchase process is the system must be capable of producing the desired benefits for years to come. In a world of constant technological advances, knowing the "true" architecture of a product is the key to reducing obsolescence, allowing for cost-effective upgrades, and reducing down time through serviceability. Sonix utilizes state-of-the-art technology that ensures your investment meets current and future expectations. Below is a listing of our line of SAM systems currently available for a variety of semiconductor inspection needs.

Products

Fusion	Combines the best features of the long-standing benchmark HS1000, UHR-2001, and Q350 products into a single Scanning Acoustic Microscope platform updated with the latest production grade components.
Vision	Advanced Acoustic Microscopy for stacked die Flip Chips and Bumped Die. - Failure Analysis - Reliability testing - Packaging - Process control.
UHR2001	Provides ultra-high resolution imaging. Ideal for general laboratory use, where small volume inspections needs are required. Specifically designed for flip chip or CSP inspections where high resolutions are needed, but can inspect all varieties of semiconductor devices. Only available as a refurbished item upon request (if available).
HT3000	The HT3000 is a SAM tool designed for the needs of production fl oor inspection. It allows for high throughput and automatic handling for either a vertical magazine of trays / boats placed into the system, or trays / boats from a handler fed in through a SMEEMA interface. Each tray / boat is loaded, debubbled, scanned, dried, and unloaded in sequence.
Quantum350	Provides ultra-high resolution imaging, yet provides a large enough scan area to inspect board mounted devices or components mounted on dual-JEDEC trays. The Quantum can be configured for laboratory use or quasi-production mode for higher throughputs. This system can inspect all varieties of semiconductor devices.
HS3600	Just like our HS1000 system, however with an expanded 36"x24" scan area. This system has been ideal for customers inspecting components mounted on large boards, sheets of materials or general purposes uses.
AW3000	A fully-automated SAM system devoted exclusively for automated, high throughput inspection of wafer substrates, and die bonded to single silicon wafers. Engineered for high throughput, high resolution imaging in a production or process control environment.
Reconditioned Systems	Occasionally Sonix has reconditioned or demo equipment available. These systems carry a full system warranty and many can be upgraded to the latest hardware and software if necessary. Call your local Sonix representative for more information or check for system availability.